Method of manufacturing photoelectric conversion connectors, as well as photoelectric conversion connector and photoelectric conversion connector device utilizing same

ABSTRACT

The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a divisional of U.S. patent application Ser. No.15/676,814, filed on Aug. 14, 2017 which claims benefit under 35 U.S.C.§ 119 and claims priority to Japanese Patent Application No. JP2016-170896, filed on Sep. 1, 2016, the content of which is incorporatedherein in its entirety by reference for all purposes.

BACKGROUND Technical Field

The present invention relates to a method of manufacturing photoelectricconversion connectors, as well as to a photoelectric conversionconnector and a photoelectric conversion connector device utilizing thesame.

Background Art

A method for manufacturing a conventional photoelectric conversionconnector device and an exemplary photoelectric conversion connectordevice are described in Patent Document 1. Such a conventionalphotoelectric conversion connector device primarily includes: a supportmember; a light-receiving element and an actuation device provided onthis support member; multiple terminals connected to the actuationdevice; a first resin member integrally molded with the light-receivingelement, actuation device, support member, terminals, and the like; anda second resin member integrally molded with the external surface ofthis first resin member.

Among these components of photoelectric conversion connector devices,the support member and terminals are formed using a planar metal leadframe that extends in a single column in one direction, and multipleconnector components considered necessary in the manufacture ofphotoelectric conversion connector devices, such as light-receivingelements, actuation devices, and the like, are disposed in a singlecolumn in one direction on this lead frame. Therefore, multiplephotoelectric conversion connector devices can be manufactured using asingle lead frame.

PRIOR ART DOCUMENTS Patent Documents Patent Document 1:

Japanese Patent Application No. 2012-177732

SUMMARY Problem to be Solved by the Invention

In the case of conventional photoelectric conversion connector devices,multiple photoelectric conversion connector devices can be manufacturedusing a single lead frame. However, this was not suitable for massproduction because in said lead frame, the connector components werearranged in a single column in one direction only.

The present invention was devised in order to eliminate such prior-artproblems and it is an object of the present invention to, in addition toproviding a manufacturing method suitable for the mass production ofphotoelectric conversion connectors, provide a photoelectric conversionconnector obtained using this manufacturing method and a photoelectricconversion connector device utilizing the same.

Means for Solving the Problem

It is an object of the invention to provide a manufacturing methodsuitable for the mass production of photoelectric conversion connectorsand, in addition, provide a photoelectric conversion connector obtainedusing this manufacturing method.

In order to solve the above-mentioned problems, a method ofmanufacturing photoelectric conversion connectors according to one modeof the present invention comprises the steps of: encapsulating a seriesof connector components arranged in a column direction among multipleconnector components on a support member that are arranged in eachdirection, respectively, in a row direction and in a column direction,in a state of substantial isolation from connector components adjacentto said series of connector components in the row direction using afirst resin member; dicing the multiple connector components on thesupport member encapsulated using the above-mentioned first resin memberinto row units in the row direction; molding the multiple connectorcomponents on the support member, which have been encapsulated using theabove-mentioned first resin member and diced, using a second resinmember on a column-by-column basis; and dicing off the multiple moldedconnector components on the support member in the column direction oneby one.

According to the manufacturing method of this mode, multiplephotoelectric conversion connectors can be mass produced at one timebecause processing is performed in a state in which multiple connectorcomponents are arranged both in the row and column directions. Inaddition, for example, if a thermosetting resin is used for the firstresin member, there is a risk that warping may occur in the supportmember upon cooling because of the coefficient of contraction, and whena series of connector components arranged in the column direction, as inthis configuration, are encapsulated at one time, the effect becomesparticularly pronounced. However, as a result of encapsulating thisseries of connector components in a state of substantial mutualisolation from adjacent connector components in the row direction, evenwhen the support member is later diced into row units, it is possible toreduce the likelihood of warping being generated in the support membersof the row units produced by dicing or the magnitude of the resultantwarping.

According to the manufacturing method of this mode, the encapsulationstep is preferably performed by encapsulating, at one time, the seriesof connector components and connector components adjacent to said seriesof connector components in the row direction using the first resinmember.

In accordance with the method of manufacturing photoelectric conversionconnectors of this mode, encapsulating all the connector componentsadjacent in the row direction at one time can improve the efficiency ofthe manufacturing process.

In the manufacturing method of the above-described mode, the first resinmember may be made of thermosetting resin and said first resin membermay be encapsulated using transfer molding.

Using transfer molding instead of injection molding can reduce the loadapplied to the connector components during the encapsulation of thefirst resin member.

In the manufacturing method of the above-mentioned mode, the secondresin member is preferably integrally molded.

Integral molding can simplify the manufacturing process. In addition,the strength of the manufactured connectors can be increased.

In the manufacturing method of the above-mentioned mode, theencapsulation with the first resin member is also preferably performedwith respect to peripheral components, which are located between theseries of connector components arranged in the column direction andconnector components adjacent to said series of connector components inthe row direction and which are not included among said connectorcomponents.

According to the method of manufacturing photoelectric conversionconnectors of this mode, peripheral components other than the connectorcomponents, such as wiring patterns and the like, can also be moldedusing the first resin member to reduce the risk of the wiring patternspeeling off the support member when the support member is diced, etc.

In the manufacturing method of the above-mentioned mode, the supportmember preferably has provided therein at least two openings mutuallyspaced apart in the row direction.

The method of manufacturing photoelectric conversion connectors of thismode can simplify the manufacturing process because the encapsulationposition of the first resin member and the molding position of thesecond resin member relative to the support member can be determinedusing these openings provided in the support member. In addition, thesupport member can be transported using these openings during machineproduction.

In the manufacturing method of the above-mentioned mode, at least twosuch openings are preferably included in each of the support membersproduced by dicing into row units in the row direction.

Providing the openings in each of the support members produced by dicingin the row direction can make it easier to work with each of the supportmembers produced by dicing.

A photoelectric conversion connector according to one mode of thepresent invention is provided with: a support member supportingconnector components, which include an optical semiconductor device usedto convert optical signals and electrical signals and a wiring patternelectrically connected to said optical semiconductor device; a firstresin member encapsulating the connector components; and a second resinmember used for molding onto the connector components encapsulated bythe above-mentioned first resin member; wherein the second resin memberhas a waveguide supporting portion that supports an optical waveguidemember used to transmit optical signals and a reflective surface thatreflects optical signals and changes their optical path, therebytransmitting optical signals between the optical waveguide member andthe optical semiconductor device, and the wiring pattern is exposed onat least a portion of a circumferential face formed by the supportmember and the first resin member.

In the photoelectric conversion connector of the above-mentioned mode,the support member may have contact connecting portions on the surfaceopposite to the surface that supports the connector components.

A photoelectric conversion connector device may be configured by furtherproviding a contact member in the photoelectric conversion connector ofthe above-mentioned mode. In addition, a shell may be further providedto cover the external surface of the photoelectric conversion connectordevice.

Effects of the Invention

The invention of this application provides a manufacturing methodsuitable for the mass production of photoelectric conversion connectors,and, in addition, provides a photoelectric conversion connector obtainedusing such a manufacturing method and a photoelectric conversionconnector device utilizing the same.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an oblique view illustrating a photoelectricconversion connector device according to the present invention alongwith a counterpart connector.

FIG. 2 illustrates an exploded oblique view of the photoelectricconversion connector device.

FIGS. 3(a) to 3(c) illustrate a photoelectric conversion connector.

FIG. 4 illustrates a cross-sectional view taken along line A-A in FIG.3(a).

FIG. 5 illustrates a central cross-sectional view illustrating a matedstate of the counterpart connector and the photoelectric conversionconnector device.

FIG. 6 illustrates a plan view of one side of the support member.

FIG. 7 illustrates a partial enlarged view of FIG. 6.

FIG. 8 illustrates a plan view of the other side of the support member.

FIG. 9 illustrates an oblique view illustrating the state of the supportmember after encapsulation.

FIG. 10 illustrates a centerline cross-sectional view of a series ofconnector components aligned in the column direction afterencapsulation.

FIG. 11 illustrates an oblique view illustrating the state of thesupport member after dicing.

FIGS. 12(a) and 12(b) illustrate the state of the support membersubsequent to molding with a resin member.

FIG. 13 illustrates an oblique view of the state illustrated in FIGS.12(a) and 12(b).

FIG. 14 illustrates a partial enlarged view of one side of the supportmember in a variation.

FIGS. 15(a) to 15(c) illustrates a photoelectric conversion connector ina variation.

FIG. 16 illustrates a cross-sectional view taken along line A-A in FIG.15(a).

FIG. 17 illustrates a cross-sectional view taken along line B-B in FIG.15(a).

FIG. 18 illustrates a lateral face view of a photoelectric conversionconnector in a variation.

DETAILED DESCRIPTION

A preferred embodiment of the present invention will be described belowwhile referring to the accompanying drawings. It should be noted thatalthough only the preferred embodiment is illustrated here forconvenience, quite naturally, this is not intended to limit the presentinvention in any way.

In FIG. 1, the inventive photoelectric conversion connector device 2 isshown in an oblique view along with a counterpart connector 8 that canbe mated and disengaged therefrom. The photoelectric conversionconnector device 2 and counterpart connector 8 can be mated anddisengaged from one another in the direction of arrow “β” shown in thefigure. The photoelectric conversion connector device 2 can be used, forexample, as a board-connected type connector installed on a circuitboard 3 by means of contacts 21, and the counterpart connector 8 can beused, for example, as a cable-connected type connector used byconnecting it to a fiber-optic cable 83. Quite naturally, they are notlimited to such modes of use.

The counterpart connector 8 may be a general-purpose optical fiberconnector. Behind the main body 81 of the counterpart connector 8, thereis provided a fiber-optic cable 83, which is an optical waveguide memberused to transmit optical signals. A portion of the fiber-optic cable 83may be covered by a hood 84. A ferrule 85, which supports thefiber-optic wire of the fiber-optic cable 83, is provided in a forwardlyprotruding configuration in front of the main body 81.

When the counterpart connector 8 and the photoelectric conversionconnector device 2 are mated, the front face of the counterpartconnector 8 and the front face of the photoelectric conversion connectordevice 2 abut and the ferrule 85 provided in the counterpart connector 8is inserted through an access hole 48, which is a waveguide supportingportion provided on the front face of the photoelectric conversionconnector device 2. As a result, the fiber-optic cable 83 is supportedin a predetermined location of the photoelectric conversion connectordevice 2.

FIG. 2 is an exploded oblique view of the photoelectric conversionconnector device 2. The photoelectric conversion connector device 2 isprovided with a photoelectric conversion connector 1 and a contactmember 20 provided in a detachable manner relative to this photoelectricconversion connector 1. The photoelectric conversion connector device 2may further have a metal shell 70 covering the external surfaces of thephotoelectric conversion connector 1 and the contact member 20.

The contact member 20 is provided with a flattened substantiallyrectangular housing 22 and multiple contacts 21 secured in place by thishousing 22. The contact member 20, which is disposed between thephotoelectric conversion connector 1 and the board 3, operates toconnect predetermined sections of the photoelectric conversion connector1 and the board 3 (see FIG. 1) by means of the contacts 21. Resilientcontact portions 21 a are formed at the distal ends of the contacts 21for connecting to the predetermined sections of the photoelectricconversion connector 1. The rear ends of the contacts 21 are used asboard connection portions 21 b.

The shell 70 covers a portion of the photoelectric conversion connector1 and contact member 20 (i.e., their external surfaces with theexception of their bottom faces and rear faces). The shell 70 is notnecessarily indispensable. For example, an embodiment may be used inwhich a shell (not shown in the drawing) is provided in the counterpartconnector 8 instead of the shell 70, such that the photoelectricconversion connector device 2 is contained within the counterpartconnector 8 and the photoelectric conversion connector 1 issubstantially covered by the shell.

The photoelectric conversion connector 1 is primarily made up of asupport member 10 that supports the connector components, a resin member30 that encapsulates the connector components, and a resin member 40molded onto the connector components encapsulated by the resin member30.

FIGS. 3(a) to 3(c) and FIG. 4 show individual aspect views of thephotoelectric conversion connector 1. FIG. 3(a) is a plan view of thephotoelectric conversion connector 1, FIG. 3(b) its front view, FIG.3(c) its bottom face view, and FIG. 4 is a cross-sectional view takenalong line A-A in FIG. 3(a).

The connector components are placed on the face 10 a of the supportmember 10. The connector components include, for example, an opticalsemiconductor device 12 used to convert optical signals and electricalsignals, various circuit elements, such as an actuation device 11 usedto drive the semiconductor device, as well as some of the wiringpatterns. In view of the dicing step that forms part of thehereinafter-described manufacturing method, portions of the wiringpatterns 15 a, 18 b are exposed on at least a portion of thecircumferential faces formed by the support member 10 and the resinmember 30, for example, on the lateral end faces 10 c and 30 c. Some ofthe exposed wiring patterns, for example, the wiring patterns 15 a, maybe electrically connected to the circuit elements. Multiple contactconnecting portions 16 are provided on the other face 10 b, which isopposite to the face 10 a of the support member 10. The contactconnecting portions 16 may be formed using pads.

The resin member 30 is formed by molding, for example, on top of theconnector components supported by the support member 10, in order toencapsulate these connector components. Due to the fact that alight-transmitting optical resin is used for the resin member 30,optical signals can be transmitted through the resin member 30. Theresin member 30, in its cross-section, includes thin layer sections 31positioned on the front and rear side, a thick layer section 32positioned approximately centrally, and, furthermore, a tapered section33 that unites the thin layer section 31 and the thick layer section 32.The actuation device 11 and optical semiconductor device 12 are buriedin the thick layer section 32 and tapered section 33.

The resin member 40 is molded onto the connector components encapsulatedby the resin member 30 and, for example, covers a portion of the upperface of the resin member 30 and the front and rear lateral faces of theresin member 30 and support member 10. By thus molding the resin member40, an access hole 48 used to support the fiber-optic cable 83 (inparticular, the ferrule 85 attached to its distal end) is formed, andthere are means for condensing and spreading optical signals (forexample, a lens 45) as well as a reflective surface 46 that transmitsoptical signals between the access hole 48 and optical semiconductordevice 12 by reflecting the optical signals and changing the opticalpath. Furthermore, the resin member 40 has legs 41 formed on the frontand rear side along the mating/disengagement direction “β”. These legs41 form a space 41 a on the other face 10 b, which is opposite to theface 10 a of the support member 10, such that the contact member 20 canbe installed in this space 41 a. The contact member 20 disposed in thespace 41 a faces the other face 10 b of the support member 10, on whichthe contact connecting portions 16 are provided, as a result of whichthe resilient contact portions 21 a of the contacts 21 provided in thecontact member 20 are connected to the contact connecting portions 16provided on the other face 10 b of the support member. The connectorcomponents on the support member 10 are electrically connected to theboard 3 by means of this contact. It is preferable to usenon-crystalline resin for the resin member 40. This is due to the factthat making it non-crystalline provides for excellent permeability dueto the wavelength of the optical signals emitted from the opticalsemiconductor device 12. In addition, in the same manner as the resinmember 30, the resin member 40 is preferably formed from alight-transmitting resin. This makes it possible to transmit opticalsignals through the resin member 40. For example, polyetherimide (PEI),polyethersulfone (PESU), polyphenylsulfone (PPSU) and other resins canbe used. Furthermore, the resin member 40 preferably has the same orsubstantially the same refractive index as the resin member 30. Thismakes it possible to prevent optical signal misregistration at theboundary of the resin member 30 and resin member 40.

FIG. 5 is central cross-sectional view illustrating a mated state of thecounterpart connector 8 and the photoelectric conversion connectordevice 2, taken along the axial line of the fiber-optic cable 83. Thefiber-optic wire 83 a of the fiber-optic cable 83 not covered by thecover 83 b is inserted into the ferrule 85. Inserting this ferrule 85into the access hole 48 of the photoelectric conversion connector device2, puts the fiber-optic wire 83 a, in particular, its distal end 83 c,in a predetermined position in the photoelectric conversion connectordevice 2. As a result, the fiber-optic wire 83 a is positioned facingthe lens 45 on the side of the photoelectric conversion connector device2 and optical signals are transmitted and received between thecounterpart connector 8 and the photoelectric conversion connectordevice 2.

As an example, the discussion below will explain how the photoelectricconversion connector device 2 is used to allow optical signals from thecounterpart connector 8 to reach the board 3 as electrical signals. Theprocess by which electrical signals of the board 3 reach the fiber-opticcable 83 as optical signals may be understood by considering thisexplanation in reverse order.

An optical signal emerging from the distal end 83 c of the fiber-opticwire 83 a provided in the counterpart connector 8 is first condensed bythe lens 45 formed in the resin member 40 and reaches the reflectivesurface 46 similarly formed in the resin member 40. With the opticalpath changed by the reflective surface 46, the signal is transmittedthrough the tapered section 33 provided at the boundary between theresin member 40 and resin member 30 and reaches the opticalsemiconductor device 12 provided in the support member 30. Theelectrical signals converted from the optical signals using the opticalsemiconductor device 12 are transmitted to the board 3 as electricalsignals by passing through the wiring pattern 15 provided on the face 10a of the support member 30 to the contact connecting portions 16provided on the other face 10 b and, further, via contact between thecontact connecting portions 16 and the resilient contact portions 21 aof the contact member 20.

Next, a description will be given of the method of manufacturing thephotoelectric conversion connector 1.

First of all, the support member 10 is prepared. FIG. 6 shows a planview of the face 10 a of the support member 10, and FIG. 7 shows apartial enlarged view thereof. For example, the support member 10 may beformed as a substrate made of resin or ceramics. On the face 10 a of thesupport member 10, respectively in the row direction (in the directionof arrow α in the figure) and in the column direction (in the directionof arrow β in the figure), there are multiple connector components 17and their peripheral components are arranged in each direction. All ofthese connector components 17 and their peripheral components may havesubstantially the same configuration. As will become apparent from thedescriptions below, only the connector components 17 are left in thefinal product (i.e., the photoelectric conversion connector 1) and theperipheral components are removed. Furthermore, although in thisexample, there is a total of 20 connector components 17, etc. arrangedin a 4×5 matrix, of course, this need not be the case, and multipleconnector components, etc. could be included in each row and column.Thus, processing the connector components 17, etc. respectively in therow direction α and in the column direction β in a state in whichmultiple connector components are arranged in each direction, makes itpossible to mass produce multiple photoelectric conversion connectors 1at one time. Furthermore, while a single connector component 17 isdescribed here as the component used to manufacture a singlephotoelectric conversion connector 1, this does not need to be the case,and two or more connector components can be used to manufacture a singlephotoelectric conversion connector 1.

The wiring patterns 15, 18 can be provided using metal plating,printing, and other methods. The wiring patterns include linear wiringpatterns 15 a and 15 c, island-shaped wiring patterns 15 b, andfurthermore, a coupling wiring pattern 18. The coupling wiring pattern18 further includes an annular pattern 18 a provided in an annularconfiguration around the outer periphery of the support member 10, inother words, in the row direction “a” and in the column direction β″,and row patterns 18 b provided in the row unit-delimiting sections inthe row direction α. At least some or all of the wiring patterns amongthese wiring patterns are electrically connected immediately prior tothe subsequent dicing step. For instance, in the examples of FIG. 6 andFIG. 7, the wiring patterns other than the island-shaped wiring patterns15 b (i.e., the patterns 15 a, 18 a, and 18 b) are all electricallyconnected immediately prior to the subsequent dicing step. As a result,according to the inventive manufacturing method, in connection with thehereinafter-explained dicing step, a portion of the wiring patterns 15,18, (e.g., the wiring patterns 15 a and 18 b) are exposed on at least aportion of the circumferential faces formed by the support member 10 andresin member 30 (e.g., the lateral end faces 10 c and 30 c formed by thesupport member 10 and resin member 30; see (b) in FIG. 2 and FIG. 3).

The linear wiring patterns 15 a, island-shaped wiring patterns 15 b, andfurthermore, some of the row patterns 18 b are the only portions of thewiring patterns 15, 18 that are included in the connector components 17.Other wiring patterns, namely, the linear wiring patterns 15 c, theannular patterns 18 a, and the rest of the row patterns 18 b are merelyperipheral components of the connector components 17, and are removedfrom the final product (i.e., the photoelectric conversion connector 1).

Circuit elements, such as optical semiconductor devices 12, actuationdevices 11, and the like, are secured to the island-shaped wiringpatterns 15 b using adhesive agents and the like. The circuit elementsand the wiring patterns other than the island-shaped wiring patterns 15b can be electrically connected by means of bonding wires 13 connectedbetween the optical semiconductor device 12 and the actuation device 11.

FIG. 8 shows a plan view of the other face 10 b of the support member10. Multiple contact connecting portions 16 are arranged on the otherface 10 b of the support member 10 in each direction, respectively, inthe row direction α and in the column direction β, in the same manner asthe connector components 17, and, in addition, so as to correspond tothe connector components 17. The contact connecting portions 16 mayinclude multiple pads 16 a designed to correspond to the multiplecontacts 21 provided in the contact member 20 (see FIG. 2, etc.).Although not apparent from the drawings, each one of these pads 16 a isconnected to a corresponding wiring pattern 15 a through the supportmember 10 using vias and the like.

As can be seen from FIG. 6 and FIG. 8, at least two openings 60 mutuallyspaced apart in the row direction α are provided in the support member10. Using these openings 60 makes it possible to determine theencapsulation position of the resin member 20 and the molding positionof the resin member 40 relative to the support member 10, therebysimplifying the manufacturing process. In particular, this configurationcan be considered suitable for machine production because the supportmember 10 can be transported using these openings 60 during machineproduction.

Next, the connector components 17 and at least some of its peripheralcomponents 15 c, 18 a are encapsulated by molding the resin member 30onto the face 10 a of the support member 10. FIG. 9 shows the state ofthe support member 10 after encapsulation in an oblique view.Encapsulation with the resin member 30 is carried out in a state inwhich a series of connector components 17A arranged in the columndirection β are substantially isolated from connector components 17adjacent to said series of connector components 17A in the row directionα. FIG. 10 shows a centerline cross-sectional view, taken in the columndirection β″, of a series of connector components 17A encapsulated bythe resin member 30. For example, if a thermosetting resin is used forthe resin member 30, warping in the support member 10 may occur uponcooling of the resin due to its coefficient of contraction. Inparticular, when a series of connector components 17A arranged in thecolumn direction β″ are encapsulated along with connector components 17adjacent to said series of connector components 17A in the row directionα, as in this configuration, the risk of warping is very high because ofthe size. However, as a result of encapsulation in a state in which aseries of connector components 17A arranged in the column direction βare substantially isolated from connector components 17 adjacent to saidseries of connector components 17A in the row direction α, as in thisconfiguration, the likelihood of generating warping or the magnitude ofthe resultant warping can be reduced. Furthermore, as used herein, theterm “substantially” means that a series of connector components 17A andconnector components 17 adjacent to said series of connector components17A in the row direction α do not need to be completely isolated and,for example, may be coupled in portion 30 a. Even if some warping doesoccur as a result of coupling, there is no substantial problem if thewarping is such that adverse effects do not occur in the subsequentdicing process and the like and, additionally, so long as the effectsthat the present invention intends to provide do not disappear.Therefore, they do not necessarily have to be completely isolated. Asdiscussed below, providing the coupling portion 30 a may sometimes bringabout novel effects.

Encapsulation with the resin member 30 is preferably performed byencapsulating not only a series of connector components 17A, but boththis series of connector components 17A and all the connector componentsadjacent to this series of connector components 17A in the row directionα at one time. Encapsulating all the connector components adjacent inthe row direction “α” at one time can ensure a more efficientmanufacturing process.

In addition to the connector components 17, encapsulation with the resinmember 30 is preferably performed also with respect to the peripheralcomponents of these connector components 17, for example, with respectto peripheral components such as the wiring patterns 15 c, which arelocated between a series of connector components 17A and connectorcomponents 17 adjacent to this series of connector components 17A in therow direction α and which are not included among the connectorcomponents 17. Covering the peripheral components of the wiring pattern15 c, which are not among the connector components 17, with the resinmember 30 can reduce the risk that wiring patterns that are connectorcomponents 17, namely, linear wiring patterns 15 a, island-shaped wiringpatterns 15 b, and some of the row patterns 18 b will be peeled off thesupport member 10 along with peripheral components such as the wiringpatterns 15 c when the support member 10 is diced, etc.

It is preferable to use a thermosetting resin for the resin member 30.Using a thermosetting resin makes it possible to use transfer molding.Although transfer molding using a thermosetting resin is believed to beunsuitable for mass production because it requires more time thaninjection molding and the like, it can reduce the load applied to theconnector components 17 during encapsulation and, for this reason, caneffectively prevent breakage of circuit elements and bonding wires.

Subsequent to the step of encapsulation with the resin member 30, theconnector components 17 encapsulated using the resin member 30 are dicedinto row units in the row direction α. FIG. 11 is an oblique view of thestate of the support member 10′ after dicing. The dicing is preferablyperformed above the coupling portion 30 a, namely, the portion 30 a thatcouples a series of connector components 17A and connector components 17adjacent to this series of connector components 17A in the row directionα. This makes it possible to reduce the risk that the wiring pattern 15a will peel off the support member 10 if warping occurs during themolding of the resin member 30. Furthermore, even after dicing thesupport member 10 into row units, an opening 60 remains in each of thesupport members 10′ produced by dicing. This makes it easier to workwith each support member 10′ produced by dicing.

After the dicing step, the multiple connector components 17 located onthe support member 10 that have been encapsulated using the resin member30 and diced are subjected to molding using the resin member 40 on acolumn-by-column basis. FIG. 12(a) is a plan view illustrating the stateof the support member 10 subsequent to molding with the resin member 40,FIG. 12(b) is a view of its bottom face, and FIG. 13 is an oblique viewthereof. As shown in FIG. 12(a), the width d of the resin member 40 inthe row direction α is set to be slightly smaller than the width D ofthe resin member 30 in the same direction. Unlike the resin member 30,the resin member 40 is integrally molded using injection molding.Integral molding can simplify the manufacturing process and, in additioncan increase the strength of the manufactured connectors. However, thethick layer section 32 of the resin member 30 is not molded using theresin member 40. The purpose is to avoid adverse effects produced byinjection pressure on the circuit elements encapsulated in the thicklayer section 32, such as the optical semiconductor device 11, etc.,during the molding of the resin member 40 (see FIG. 4, etc.). As aresult, a space 26 is formed above the thick layer section 32. On theother hand, portions 42 and 43 of the resin member 40 are molded on topof the thin layer section 31 of the resin member 30, thereby firmlysecuring the resin member 40 to the resin member 30.

Finally, the multiple connector components 17 located on the supportmember 10, onto which the resin member 40 has been molded, are diced offone-by-one in the column direction β. The dicing location is between thewidth D of the resin member 30 and the width d of the resin member 40shown in FIG. 12(a). This can effectively prevent problems such aspeeling of the wiring patterns and the like.

Upon accomplishing the steps above, the manufacture of the photoelectricconversion connector 1 shown in FIG. 2 and FIG. 4, etc., is completed. Aphotoelectric conversion connector device 2 (see FIG. 2, etc.) can beobtained by attaching a contact member 20 to this photoelectricconversion connector 1. A shell 70 may also be attached to thisphotoelectric conversion connector device 2.

Variations of the inventive photoelectric conversion connector will nowbe described with reference to FIGS. 14-18. In the embodimentillustrated in FIG. 1, etc., a single optical semiconductor device wasprovided in one photoelectric conversion connector. However, in thisvariation, multi-conductor bidirectional communication is made possibleby providing multiple optical semiconductor devices in a singlephotoelectric conversion connector. In this variation, in particular,dual-conductor bidirectional communication is made possible by providingtwo optical semiconductor devices 14 and 19. In addition, in thisvariation, the wiring patterns are different from those of FIG. 1.

FIG. 14 corresponds to FIG. 7 of the previous embodiment, namely, to apartial enlarged view of one side of the support member, FIG. 15(a)corresponds to the FIG. 3(a), namely, to a plan view of thephotoelectric conversion connector, FIG. 15(b) corresponds to FIG. 3(b),namely, to a front view of the photoelectric conversion connector, andFIG. 15(c) corresponds to FIG. 3(c), namely, to a view of the bottomface of the photoelectric conversion connector. FIG. 16 shows across-sectional view taken along line A-A in FIG. 15(a), FIG. 17 shows across-sectional view taken along line B-B in the same figure, and FIG.18 shows a lateral face view of the photoelectric conversion connectoraccording to the variation. Furthermore, the same reference numerals areused for members identical to the members used in the embodimentillustrated in FIG. 1, etc., and the character “A” is added ifnecessary. Details that are not explained here should be consideredsimilar to the embodiment illustrated in FIG. 1, etc.

As shown in FIG. 14, one optical semiconductor device 14 used forreception and one optical semiconductor device 19 used for transmissionare provided on the support member 10A used in this photoelectricconversion connector 1A. As shown in FIGS. 16-18, a lens used fortransmission 51 and a lens used for reception 52 are disposed inparallel to each other in a matching configuration. An access hole 48Ais formed in an elliptic configuration expanded in the width directionin order to accommodate both a transmitting fiber-optic cable of acounterpart connector and a receiving fiber-optic cable. A reflectivesurface 46A, which is disposed to face lenses 51 and 52 is formed in thesame manner, and can be used both for transmitting and receiving. Inthis manner, providing multiple optical semiconductor devices makes itpossible to handle multi-conductor bidirectional communication. Inaddition, as shown in FIG. 15, in the photoelectric conversion connector1A, in view of the dicing step, a portion of the wiring patterns 15, 18,for example, the wiring patterns 15 a and 18 b are exposed on at leastsome of the circumferential faces formed by the support member 10 andresin member 30, for example, on the lateral end faces 10 c and 30 c.

Furthermore, the present invention is not limited to the above-describedembodiments, and various other changes are possible. Therefore, thedrawings and specifications are merely illustrative, and the inventionis not limited thereto.

For example, the shape of the resin member 40 is not limited to theshape disclosed in the embodiments and various shapes can be used. As anexample, the access hole 48 used to support the ferrule 85 may be shapedto securely support a fiber and may have formed therein a matable matingportion that permits connection/disconnection from the contact member20. Therefore, the inventive manufacturing method can be applied toresin members 40 of various shapes and to photoelectric conversionconnectors of various types.

In addition, the wiring patterns 15, 18 are not limited to the patternsdisclosed in the embodiments and, depending on the situation, can assumevarious shapes. The locations where the wiring patterns are exposed neednot be limited to the lateral end faces 10 c and 30 c. As will beapparent from the Specification above, all of at least some of thewiring patterns are electrically connected until immediately before thesubsequent dicing step. As a result, after the dicing step, at least aportion thereof will be necessarily exposed on at least a portion of thecircumferential faces formed by the support member 10 and resin member30. In this case, depending on the shape of the wiring pattern, thewiring pattern may be exposed not on the lateral end faces, but, forexample, on the end faces in the fore-and-aft direction. Therefore, thelocations where the wiring patterns are exposed will occupy at least aportion of the circumferential faces formed by the support member 10 andresin member 30 and are not limited to the lateral end faces.Furthermore, the sections where the wiring patterns are exposed may becovered by the resin member 40. However, they do not need to be covered.

DESCRIPTION OF THE REFERENCE NUMERALS

-   1 Photoelectric conversion connector-   2 Photoelectric conversion connector device-   8 Counterpart connector-   10 Support member-   10 c Lateral face-   11 Actuation device-   12 Optical semiconductor device-   13 Bonding wire-   15 Wiring pattern-   16 Contact connecting portion-   17 Connector components-   18 Wiring pattern-   220 Contact member-   21 Contact-   30 First resin member-   30 a Coupling portion-   30 c Lateral face-   40 Second resin member-   45 Lens-   46 Reflective surface-   48 Access hole-   51 Lens-   52 Lens-   60 Locating opening-   70 Shell-   83 Fiber-optic cable-   83 a Fiber-optic wire-   83 c Distal end

1. A photoelectric conversion connector comprising: a support membersupporting connector components, comprising an optical semiconductordevice configured to convert optical signals and electrical signals anda wiring pattern electrically connected to said optical semiconductordevice; a first resin member encapsulating the connector components; anda second resin member used for molding onto the connector componentsencapsulated by the above-mentioned first resin member; wherein thesecond resin member has a waveguide supporting portion that supports anoptical waveguide member used to transmit optical signals and areflective surface that reflects optical signals and changes theiroptical path, thereby transmitting optical signals between the opticalwaveguide member and the optical semiconductor device, and the wiringpattern is exposed on at least a portion of a circumferential faceformed by the support member and the first resin member.
 2. Thephotoelectric conversion connector according to claim 1, wherein thesupport member has contact connecting portions on the surface oppositeto the surface that supports the connector components.
 3. Thephotoelectric conversion connector of claim 1, further comprising acontact member connecting the contact connecting portions to a board. 4.The photoelectric conversion connector according to claim 3, furthercomprising a shell covering an external surface of the photoelectricconversion connector device.